An exploration of the effects of low-pressure plasma discharge on the physico-chemical properties of chia (Salvia hispanica L.) flour

Authors

  • Rohit Upadhyay Research & Development, General Mills India Pvt Ltd., Mumbai 79, India
  • Rohit Thirumdas Department of Food Engineering & Technology, Institute of Chemical Technology, Mumbai, India
  • Rajendra R. Deshmukh Department of Physics, Institute of Chemical Technology, Mumbai, India
  • Uday Annapure Department of Food Engineering & Technology, Institute of Chemical Technology, Mumbai, India
  • Nrusimha N. Misra Department of Engineering, Faculty of Agriculture, Dalhousie University, NS, Canada

DOI:

https://doi.org/10.7251/JEPM1902073U

Keywords:

electrical discharge, grains, fatty acid, functional property

Abstract

This work explores the preliminary feasibility of employing the low-pressure cold plasma technology for the modification of the properties of chia flour. Chia flour was exposed to low pressure plasma in air for 5 min, 10 min, and 15 min, at two different power levels (40 W and 60 W). The oils extracted from untreated and treated chia flour were exhaustively characterized for fatty acid composition, nutritional value, and rancidity indices using thermal calorimetric methods (DSC/TGA). The results indicated a significant change in the colour of flour with an increase in lightness. Infrared and ultraviolet spectroscopy indicated changes in the tocopherol groups of the oil extracted from plasma treated chia flour. However, the oil extracted from plasma treated chia flour revealed a loss of conjugated dienes and formation of trans-fatty acids as seen in conventional hydrogenation of edible oils. DSC and TGA results revealed better oxidative stability of low-pressure plasma treated oils than control, which was linked to a relative increase of MUFA in the former.

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Published

2019-12-31

How to Cite

Upadhyay, R., Thirumdas, R., R. Deshmukh, R., Annapure, U., & N. Misra, N. (2019). An exploration of the effects of low-pressure plasma discharge on the physico-chemical properties of chia (Salvia hispanica L.) flour. Journal of Engineering &Amp; Processing Management, 11(2), 73–80. https://doi.org/10.7251/JEPM1902073U